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KOLZER, design and manufacturing of metallizers and pvd, plasma, pecvd, sputtering equipment KOLZER - www.kolzer.it - via Francia, 4 - 20093 Cologno Monzese (MI), Italy
Antonio D'Esposito, E-Mail: info@kolzer.it, Tel. +39 02 25 43 193, Fax +39 02 27 305 586
products:
high vacuum coating systems, vacuum pumps, vacuum components
company profile:
founded 1952, design and manufacturing of metallizers and pvd, plasma, pecvd, sputtering equipment, vacuum metallizing turn-key line.

Sputter coaters QUORUM TECHNOLOGIES LTD - www.quorumtech.com - 15A Euro Business Park, BN90DQ Newhaven, United Kingdom
Mike WOMBWELL, E-mail: mike.wombwell@quorumtech.com, Tel. +44(0)1273 510535, Fax +44(0)1273 510536
products:
Sputter coaters, carbon coaters, thermal evaporators, RF plasma etchers, critical point dryers, small freeze dryers, cryogenic stages for SEM
company profile:
Quorum Technologies are the manufacturers of the Polaron range of EM preparation instruments.

LewVac thin film thickness controller LewVac LLP - www.lewvac.co.uk - 139 High Street, Lewes, East Sussex BN7 1XS, United Kingdom
E-Mail: sales@lewvac.co.uk, Tel.+44 (0)1273 487448, Fax +44 (0)1273 476246
products:
We are pleased to offer a broad range of quartz crystal sensor heads, deposition rate controllers and thickness rate monitors, along with all of the associated accessories. Sensors are available as standard models or can be easily tailored to suit your particular requirements.
company profile:
LewVac is a UK-based supplier of HV and UHV components to the vacuum technology market, with a product range of many thousands of quality components.
Our range of vacuum components is carefully selected from a broad base of manufacturers, enabling us to be competitively priced and to offer short lead times on standard products.

ALLIANCE CONCEPT - thin film coating systems ALLIANCE CONCEPT - www.alliance-concept.com - 4, Avenue du Pont de Tasset, 74960 Cran Gevrier, France
E-Mail: contact@alliance-concept.com, Tel. +33 4 50 57 93 85, Fax +33.4 50 57 93 74
products:
Dépôt sous vide (Evaporation sous vide, pulvérisation cathodique, magnétron DC/RF, dépôt en plasma CVD), gravure, procédés plasma.



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